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data sheet broadcom asmg-pt00-ds100 march 23, 2018 description the broadcom ? 1w tri-color high power led light source is a high-performance, energy-efficient device that can handle high thermal and high driving current. the low-profile package design is suitable for a wide variety of applications, especially whe re height is a constraint. the package is compatible w ith the reflow soldering process. this will gi ve more freedom and flexibility to the light source designer. features ? available in tri-color ? energy efficient ? compatible with refl ow soldering process ? high current operation ? long operation life ? silicone encapsulation ? moisture sensitivity level 1 applications ? sign backlight ? retail display ? commercial lighting ? decorative lighting ? architectura l lighting caution! this led is class 3b esd sensiti ve per ansi/esda/jedec js-001. please observe appropriate precautions during handling and processing. refer to application note an-11 42 for additional details. ASMG-PT00-00001 1w tri-color high power led
broadcom asmg-pt00-ds100 2 ASMG-PT00-00001 data sheet 1w tri-color high power led package dimensions note: 1. all dimensions are in millimeters (mm). 2. tolerance is 0.2 mm unl ess otherwise specified. 3. encapsulation = silicone. 4. terminal finish = silver plating. 5. thermal pad is connect ed to the anode of red.
broadcom asmg-pt00-ds100 3 ASMG-PT00-00001 data sheet 1w tri-color high power led device selection guide t j = 25c, i f = 150 ma. absolute maximum ratings part number color luminous flux, ? v (lm a, b a. luminous flux is the total flux output as measured with an in tegrating sphere at a mono pulse condition. b. luminous flux tolerance = 10%. dice technology min. typ. max. ASMG-PT00-00001 red 25.0 28.0 35.0 allngap green 38.0 45.0 54.0 ingan blue 8.1 9.5 11.5 ingan parameter rating units dc forward current a a. derate linearly as shown in figure 7 and figure 8 . 200 ma peak forward current b b. duty factor = 10%, frequency = 1 khz. 250 ma reverse voltage not designed for reverse bias led junction temperature 120 c operating temperature range -40 to +105 c storage temperature range -40 to +120 c
broadcom asmg-pt00-ds100 4 ASMG-PT00-00001 data sheet 1w tri-color high power led optical and electrical characteristics t j = 25c. part numbering system parameter min. typ. max. units test conditions viewing angle, 2? a a. 2? is the off axis angle where the luminous intensity is hal f of the peak intensity. 155degi f = 150 ma forward voltage, v f b b. forward voltage tolerance = 0.1v. vi f = 150 ma red 1.8 2.2 2.8 green 2.8 3.1 3.7 blue 2.8 3.0 3.7 dominant wavelength, ? d c c. the dominant wavelength is derived from the cie chromaticity diagram and represents the per ceived color of the device. nm i f = 150 ma red 620.0 623.0 630.0 green 525.0 530.0 535.0 blue 455.0 458.0 460.0 peak wavelength, ?? p nm i f = 150 ma red 630.0 green 522.0 blue 455.0 thermal resistance, r j-s c/w led junction to solder point red 10 green 20 blue 10 asmg - p x 1 00 - 0 x 2 x 3 x4 1 code description option x 1 color t tri-color x 2 x 3 minium flux bin (lm) maximum flux bin (lm) 00 red: 25.0C35.0 lm green: 38.0C54.0 lm blue: 8.1C11.5 lm x 4 color bin 0 full distribution
ASMG-PT00-00001 data sheet 1w tri-color high power led broadcom asmg-pt00-ds100 5 bin information flux bin limit (cat) tolerance = 10%. example of bin information on reel and packaging label: color bin limit (bin) tolerance = 1 nm. color bin luminous flux (lm) min. max. red 25.0 35.0 green 38.0 54.0 blue 8.1 11.5 bin: 42a red color bin 4 green color bin 2 blue color bin a color bin id forward volage (v) min. max. red 4 620.0 630.0 green 2 525.0 535.0 blue a 455.0 460.0
broadcom asmg-pt00-ds100 6 ASMG-PT00-00001 data sheet 1w tri-color high power led figure 1: relative luminous flu x vs. mono pulse current figure 2: forward current vs. forward voltage 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 0 25 50 75 100 125 150 175 200 relative luminous flux (normalized at 150 ma) mono pulse current - ma red green blue 0 20 40 60 80 100 120 140 160 180 200 0 0.5 1 1.5 2 2.5 3 3.5 4 forward current - ma forward voltage - v red green blue )ljxuhrpldwdyhohjw6liwyv0rr3xovhxuuhw )ljx uh5hodwlyh/l jw2xwsxwyv-xfwlr7hpshudwxuh -4 -2 0 2 4 6 8 10 12 14 0 20 40 60 80 100 120 140 160 180 200 dominant wavelength shift - nm (normalized at 150 ma) mono pulse current -ma red green blue 0 20 40 60 80 100 120 25 50 75 100 125 relative light output - % (normalized at 25 c) junction temperature, t j -c red green blue )ljxuh)ruzdug9rowdjh6liwyv-xfwlr7hpshudwxuh )ljxuh rpldwdyhohj w6liwyv -xfwlr 7hpshudwxuh -0.6 -0.5 -0.4 -0.3 -0.2 -0.1 0.0 0.1 0.2 25 50 75 100 125 forward voltage shift - v (normalized at 25 c) junction temperature,t j - c red green blue -2.0 -1.0 0.0 1.0 2.0 3.0 4.0 5.0 6.0 25 50 75 100 125 dominant wavelength shift - nm (normalized at 25 c) junction temperature, t j -c red green blue
broadcom asmg-pt00-ds100 7 ASMG-PT00-00001 data sheet 1w tri-color high power led figure 7: derating curve according to solder point temperature (t s ) figure 8: derating curve acco rding to ambient temperature (t a ) . derated based on t jmax = 120c, r j-a = 50c/w for red and blue and r j-a = 60c/w for green. 0 50 100 150 200 250 0 20406080100120 max allowable dc current - ma solder point temperature, t s - c red and blue green 0 50 100 150 200 250 0306090120 max allowable dc current - ma ambient temperature, t a - c red green blue figure 9: pulse handling capability at t s 100c for allngap figure 10: pulse handling capability at t s 100c for ingan 1e-05 0.0001 0.001 0.01 0.1 1 10 i p - pulse current - a t p - pulse duration - sec 0.15 0.16 0.17 0.18 0.19 0.20 0.21 0.22 0.23 0.24 0.25 0.26 0.27 0.28 0.29 0.30 1e-05 0.0001 0.001 0.01 0.1 1 10 i p - pulse current - a t p - pulse duration - sec )ljxuh5dgldwlr3dwwhuiru5hg )ljxuh5dgldwlr3dww huiruuhh 0.00 0.25 0.50 0.75 1.00 -90 -60 -30 0 30 60 90 normalized intensity angular displacement - degrees 0.00 0.25 0.50 0.75 1.00 -90 -60 -30 0 30 60 90 normalized intensity angular displacement - degrees
broadcom asmg-pt00-ds100 8 ASMG-PT00-00001 data sheet 1w tri-color high power led figure 13: radiation pattern for blue figure 14: spectral powe r distribution 0.00 0.25 0.50 0.75 1.00 -90 -60 -30 0 30 60 90 normalized intensity angular displacement - degrees 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 380 480 580 680 780 relative intensity wavelength - nm red green blue )ljxuh5hfrpphghg6roghulj/dg3dwwhupp units: mm.
broadcom asmg-pt00-ds100 9 ASMG-PT00-00001 data sheet 1w tri-color high power led figure 16: carrier tape dimensions note: 1. drawing not to scale. 2. all dimensions are in millimeters. 3. tolerance is 0.10 mm un less otherwise specified.
broadcom asmg-pt00-ds100 10 ASMG-PT00-00001 data sheet 1w tri-color high power led figure 17: reel dimensions note: 1. 500 pieces per reel. 2. drawing not to scale 3. all dimensions are in millimeters. a c n w2 178.01.0 13.10.5 60.00.5 16.20.5
ASMG-PT00-00001 data sheet 1w tri-color high power led broadcom asmg-pt00-ds100 11 soldering recommended reflow so ldering conditions: figure 18: recommended reflow soldering profile ? do not perform reflow sol dering more than twice. ? do not apply any pressure or force on the led during reflow and after reflow wh en the led is still hot. ? use reflow soldering to sol der the led. hot plate should only be used for rework if unavoidable but must be strictly controlled to the following conditions: C led temperature = 260c max. C time at maximum temperature = 20s max. ? confirm beforehand whethe r the functionality and performance of the led is affected by soldering with hot plate. ? hand soldering is not recommended. precautionary notes handling precautions the encapsulation material o f the led is made of silicone for better produc t reliability. com pared to epoxy encapsulant that is hard and br ittle, silicone is softer and flexible. observe special handling precautions during assembly of silicone encapsul ated led products. failure to comply might lead to damage and premature failure of the led. do refer to application note an5288, s ilicone encapsulation for led: advantages and handling precautions for more information. ? do not poke sharp objects int o the silicone encapsulant. sharp objects, such as tweezers or syringes, might apply excessive force or e ven pierce through the silicone and induce failures to the led die or wire bond. ? do not touch the silicone encapsulant. uncontrolled force acting on th e silicone encapsula nt might result in excessive stress on the wir e bond. hold the led only by the body. ? do not stack assembled pcbs together. use an appropriate rack to hold the pcbs. ? the surface of the silicone material at tracts dust and dirt easier than epoxy due to its surface tackiness. to remove foreign particles on the surface of silicone, use a cotton bud with isopropy l alcohol (ipa). during cleaning, rub the surface gently without putting too much pressure on the silico ne. ultrasonic cleaning is not recommended. ? for automated pick-and-place, broadcom has tested the following nozzle size t o work well with this led. however, due to the possibilit y of variations in other parameters, such as pick-and-place machine maker/ model and other settings of the machine, verify that the selected nozzle will not cause damage to the led. figure 19: nozzle size ? storage the soldering terminals of these leds are silver plated. if the leds are exposed in an ambient environment for too long, the silver plating m ight be oxidized and thus affecting its solderability performance. as such, keep unused leds in a sealed moi sture barrier bag (mbb) with desiccant or in desiccator at <5%rh. application precautions ? the drive current of the led must not exceed the maximum allowable limit across temperature as stated in the data sheet . constant current driving is recommended to ensure consistent performance. ? the led is not intended fo r reverse bias. use other appropriate components for such purposes. when driving the led in matrix fo rm, ensure that the reverse bias voltage does not exceed the allowable limit of the led. (acc. to j-std-020c) 217 q c 200 q c 60 - 120 sec. 6c/sec. max. 3 q c/sec. max. 3c/sec. max. 150 q c 255 - 260 q c 100 sec. max. 10 - 30 sec. time temperature
ASMG-PT00-00001 data sheet 1w tri-color high power led broadcom asmg-pt00-ds100 12 ? do not use the led in the vicinity of material with sulfur content, in environments of high gaseous sulfur compound and corrosive elements. examples of materials that may contain s ulfur are rubber gaskets, rtv (room temperature vulc anizing) silic one rubber, rubber gloves, and so on. prolonged exposure to such environments may affect the optical characteristics and product life. ? avoid rapid changes in ambi ent temperature especially in high-humidity environments as this will cause condensation on the led. ? if the led is intended to be used in harsh or outdoor environments, protect the l ed by means of protective cover against damages caused by rain water, dust, oil, corrosive gases, external mechanical stress, and so on. thermal management optical, electrical and reliabilit y characteristics of led are affected by temperature. the junction temperature (t j ) of the led must be kept below a llowable limit at all times. t j can be calculated as follows: t j = t s + r j-s i f v fmax figure 20: thermal management to measure the soldering point temperature, a thermocouple can be mounted on the t s point as shown in the preceding figure. verify the t s of the led in the final product to ensure that the l eds are operat ed within all maximum ratings state d in the datasheet. eye safety and precautions leds may pose optical hazard s when in opera tion. do not look directly at operating leds as it may be harmful to the eyes. for safety reasons, use appropriate shielding or personnel protection equipment. where t s = led solder point temperature as shown in the followin g figure (c) r j-s = thermal resistance from junction to solder point (c/w) i f = forward current (a) v fmax = maximum forwa rd voltage (v)
broadcom, the pulse logo, connect ing everything, avago technolo gies, avago, and the a logo are among the trademarks of broadcom and/or it s affiliates in the un ited states, certain other countries, and/or the eu. copyright ? 2018 broadcom. all rights reserved. the term broadcom refers to broadcom inc. and/or its subsidia ries. for more information, please visit www.broadcom.com . broadcom reserves the right to ma ke changes without further not ice to any products or data he rein to improve reliability, function, or design. information furnished by broadcom is belie ved to be accurate and reliable. however, broadcom does not assume any liability arising out of the application or use of this information, nor the app lication or use of any product or circuit described herein, neither does it convey any license un der its patent rights nor the rights of others. disclaimer broadcom's products and software are not specifically designed, manufactured, or authorized for sale as parts, components, or assemblies for the planning, c onstruction, maintenance, or d irect operation of a nuclear fa cility or for use in medical devices or applications. the cust omer is solely responsible, an d waives all rights to make clai ms against broadcom or its suppliers, for all lo ss, damage, expense, o r liability in conne ction with such use.

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